Before the introduction of thermally conductive gel, thermally conductive silicone sheet was one of the materials commonly used in the heat dissipation and heat conduction market. It can be said that thermally conductive silicone sheet has solved a large number of heat conduction problems in the past many years. With the rapid development of science and technology, the functions of electronic products have been developing towards integration. Thermally conductive circuit boards have become smaller, while more and more electronic components. The heat source of the circuit board is too concentrated, and the space between the heat sources is of different heights and shapes. The power of electronic products is also increasing, so the requirements for thermally conductive materials are getting higher and higher. More and more heat conduction problems can no longer be satisfied by a single thickness of thermally conductive silicone sheet.

The thermal conductive silicone sheet requires a certain assembly pressure during the assembly process, which will inevitably generate a certain stress on the circuit board. In the use scene that requires extremely low stress, the hardness of the thermal conductive sheet is as low as possible, but the hardness is extremely low Under the circumstance, the thermal conductive sheet will appear mucous, which makes the operation extremely difficult. The thermal conductive gel independently developed and produced by Shenzhen Lian Tengda Technology Co., Ltd. is a new type of gel-like thermal conductive material made of silica gel composite thermal conductive filler, after stirring, mixing and packaging. Adopting glue-dispensing design, it can be ejected with a mixed glue nozzle when in use, and it can realize automatic production, which is very convenient.

The biggest advantage of the two-component thermal gel compared to the thermally conductive silicone sheet is that the thermally conductive gel can be filled with various irregular shapes, and the assembly stress is very low, the hardness after vulcanization is very low, and the expansion coefficient is very small. In comparison, The thermal gel is more diversified in formula design, and can improve the stability of the circuit board. In terms of material utilization, thermally conductive silicone sheets will have problems such as unqualified dimensions and cutting edge material loss during the forming and cutting process. The thermally conductive gel can be accurately controlled by the automatic dispensing machine, regardless of the material The utilization rate is still better than the thermal conductive sheet.